Back grind tape
Achieves stable low particle characteristics, eliminating the need for cleaning processes! Adheres closely to the uneven surfaces of the wafer circuit!
The "Back Grind Tape" is a tape that can protect the circuit surface during the grinding of the wafer's backside. Designed with an adhesive that does not require a cleaning process, it combines low particle generation and stable grindability. It has minimal changes in adhesive strength over time, ensuring stable release properties. 【Features】 ■ Excellent adhesion to the unevenness of the wafer circuit surface ■ Stable grindability during back grinding (low TTV) ■ Eliminates the need for a cleaning process by achieving stable low particle characteristics ■ Minimal changes in adhesive strength over time, ensuring stable release properties *For more details, please refer to the PDF document or feel free to contact us.
- Company:デンカ
- Price:Other